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GND V_A SDO TPM NDM V_A GND V_E GND_E DId0+ V_DR DId3+ GND_DR DId6+ V_DR DId9+ GND_DR DId11+ DId11- GND_DR

V/jointfilesconvert/273523/bg GND ECEb SDI CalRun V_A GND GND_E V_E DId0- DId2+ DId3- DId5+ DId6- DId8+ DId9- DId10+ DI0+ DI1+ DI1-

Rtrim+ Vcmo Rext+ SCSb SCLK V_A NC V_E GND_E DId1+ DId2- DId4+ DId5- DId7+ DId8- DId10- DI0- V_DR DI2+ DI2-

DNC Rtrim- Rext- GND GND CAL DNC V_A V_A DId1- V_DR DId4- GND_DR DId7- V_DR GND_DR V_DR DI3+ DI4+ DI4-

V_A Tdiode+ DNC GND GND_DR DI3- DI5+ DI5-

V_A GND_TC Tdiode- DNC GND_DR DI6+ DI6- GND_DR

V_TC GND_TC V_TC V_TC DI7+ DI7- DI8+ DI8-

VinI+ V_TC GND_TC V_A GND GND GND GND GND GND DI9+ DI9- DI10+ DI10-

VinI- GND_TC V_TC VbiasI GND GND GND GND GND GND V_DR DI11+ DI11- V_DR

GND VbiasI V_TC GND_TC GND GND GND GND GND GND ORI+ ORI- DCLKI+ DCLKI-

GND VbiasQ V_TC GND_TC GND GND GND GND GND GND ORQ+ ORQ- DCLKQ+ DCLKQ-

VinQ- GND_TC V_TC VbiasQ GND GND GND GND GND GND GND_DR DQ11+ DQ11- GND_DR

VinQ+ V_TC GND_TC V_A GND GND GND GND GND GND DQ9+ DQ9- DQ10+ DQ10-

V_TC GND_TC V_TC V_TC DQ7+ DQ7- DQ8+ DQ8-

V_A GND_TC V_TC V_TC V_DR DQ6+ DQ6- V_DR

V_A GND_TC GND_TC GND V_DR DQ3- DQ5+ DQ5-

GND_TC CLK+ PDI GND GND

RCOut1-

DNC V_A V_A DQd1- V_DR DQd4- GND_DR DQd7- V_DR V_DR GND_DR DQ3+ DQ4+ DQ4-

CLK-

DCLK

_RST+

PDQ CalDly DES

RCOut2+ RCOut2-

V_E GND_E DQd1+ DQd2- DQd4+ DQd5- DQd7+ DQd8- DQd10- DQ0- GND_DR DQ2+ DQ2-

DCLK

_RST-

GND DNC DDRPh RCLK- V_A GND GND_E V_E DQd0- DQd2+ DQd3- DQd5+ DQd6- DQd8+ DQd9- DQd10+ DQ0+ DQ1+ DQ1-

GND V_A FSR RCLK+

RCOut1+

V_A GND V_E GND_E DQd0+ V_DR DQd3+ GND_DR DQd6+ V_DR DQd9+ GND_DR DQd11+ DQd11- GND_DR

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ADC12D1800RF

SNAS518I –JULY 2011–REVISED JANUARY 2014

www.ti.com

2.3 Connection Diagram

Figure 2-3. ADC12D1800RF Connection Diagram

The center ground pins are for thermal dissipation and must be soldered to a ground plane to

ensure rated performance. See SUPPLY / GROUNDING, LAYOUT AND THERMAL

RECOMMENDATIONS for more information.

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Product Folder Links: ADC12D1800RF

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