ADC 2 Spezifikationen Seite 23

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LTC4261/LTC4261-2
23
42612fd
For more information www.linear.com/LTC4261
Configuring the PGIO Pin
Table 6 describes the possible states of the PGIO pin us-
ing the CONTROL register bits D6 and D7. At power-up
the default state is for the PGIO pin to pull low when
the second power good signal is ready
. Other uses for
the PGIO pin are to go high impedence when the sec
-
ond power good is ready
, a general purpose output and a
general purpose input. When the PGIO pin is configured
as a general purpose output, the status of bit C6 is sent
out to the pin. When it is configured as a general pur
-
pose input, if the input voltage at PGIO is higher than
1.25V
, both bit A6 in the ST
ATUS register and bit B6 in
the FAULT register are set. If the input voltage at PGIO
subsequently drops below 1.25V, bit A6 is cleared. Bit
B6 can be cleared by resetting the FAULT register as de
-
scribed previously.
Design Example
As a design example, consider the 200W application with
C
L
= 330µF as shown in Figure 1. The operating voltage
range is from 43V to 71V with a UV turn-off threshold of
38.5V.
The design flow starts with calculating the maximum in
-
put current:
I
MAX
=
200W
36V
= 5.6A
where 36V is the minimum input voltage.
The selection of the sense resistor, R
S
, is determined by
the minimum current limit threshold and maximum input
current:
R
S
=
DV
SENSE(MIN)
I
MAX
=
45mV
5.6A
= 8mW
The inrush current is set to 0.66A using C
R
:
C
R
= C
L
I
RAMP
I
INRUSH
= 330µF •
20µA
0.66A
= 10nF
The value of R
F
and C
F
are chosen to 1k and 33nF as
discussed previously.
The FET is selected to handle the maximum power dissi-
pation during start-up or an input step. The latter usually
results in a larger power due to summation of the inrush
current charging C
L
and the load current. For a 36V input
step, the total P
2
t in the FET is approximated by:
P
2
t = 36V I
MAX
( )
2
t
3
where t is the time it takes to charge up C
L
:
t =
C
L
36V
I
INRUSH
=
330µF • 36V
0.66A
= 18m
s
which gives a P
2
t value of 244W
2
s.
Now the P
2
t given by the SOA (safe operating area)
curves of candidate FETs must be higher than 244W
2
s.
The SOA curves of the IRF1310NS provide for 5A at 50V
(250W) for 10ms, which gives a P
2
t value of 625W
2
s and
satisfies the requirement.
Sizing R1, R2 and R3 for the required UV and OV thresh
-
old voltages:
V
UV(RISING)
= 43V, V
UV(FALLING)
= 38.5V, (using
V
UVH(TH)
= 2.56V and V
UVH(TH)
= 2.291V)
V
OV(RISING)
= 72.3V, V
OV(FALLING)
= 70.7V (using
V
OV(TH)
= 1.77V rising and 1.7325V falling)
Layout Considerations
To achieve accurate current sensing, a Kelvin connection
is recommended (Figure 10). The minimum trace width
for 1oz copper foil is 0.02" per amp to make sure the
trace stays at a reasonable temperature. Using 0.03" per
amp or wider is recommended. Note that 1oz copper ex
-
hibits a sheet resistance of about 530µW/square. Small
resistances add up quickly in high current applications.
The V
EE
pin of the LTC4261 should be connected to a
separate plane that is different from the main –48V in-
put plane. To improve noise immunity, as shown in
Figure
10, the V
EE
connections of all capacitors, resistive
dividers, opto-isolators and I
2
C common must be made
directly to the local V
EE
plane, not the –48V input plane.
APPLICATIONS INFORMATION
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